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The Advanced Packaging and Interconnect Alliance -APiA- to Supply ACE Semiconductor With 200 mm Advanced Packaging Process Line in China.
Business Wire; Jul 10, 2002; 700+ Words ...newest advanced packaging fab in Shanghai...China's burgeoning advanced packaging industry...statements regarding the Advanced Interconnect and Packaging Alliance (APiA...of the APiA's product and process developments...APiA-developed products, and the ability...Casio ...
New Report Examines the Challenging IC Advanced Packaging Industry.
M2 Presswire; Jan 14, 2008; 700+ Words ...the Challenging IC Advanced Packaging Industry(C)1994...the addition of IC Advanced Packaging Industry...continual advent of new products and the shortened lifecycle...complete semiconductor product, expense on packaging...technology R&D as advanced package demands ...
Rio Design Automation Recognized by Advanced Packaging Magazine in its 4th Annual Advanced Packaging Awards Competition.
Business Wire; Jul 9, 2007; 700+ Words ...year's Advanced Packaging Awards. Instituted in 2004, the Advanced Packaging Awards honor products and technologies...editor-in-chief, Advanced Packaging magazine. "Advanced Packaging is the...executive officer and co-founder of Rio...
Tegal Joins APiA, The Advanced Packaging and Interconnect Alliance.
Business Wire; Jul 16, 2002; 700+ Words ...of the Advanced Packaging and Interconnect...leading authority on advanced packaging and interconnect...committee of the Advanced Packaging and Interconnect...etch processes for advanced packaging applications...recognition of superior product quality, ...
The Advanced Packaging and Interconnect Alliance -APiA- Adds New Member and Continues to Provide Educational Seminars to the Advanced Packaging Community.
Business Wire; Jun 4, 2003; 700+ Words ...2003 The Advanced Packaging and Interconnect...alliance on emerging advanced packaging and interconnect...resource for the advanced packaging community...brightest minds on the advanced packaging challenges...Technology (Shanghai) Co., Ltd., TechSearch...of the ...
Bruce Hueners of Palomar Technologies Elected to Editorial Board of Advanced Packaging Magazine.
Business Wire; Sep 18, 2003; 700+ Words ...board of Advanced Packaging magazine. Advanced Packaging, a PennWell...in-chief of Advanced Packaging. "He...constant figure in Advanced Packaging that we...Hughes Aircraft Co., has been an...or validating new products by providing design...the gap between ...
Taipei pack 2009 highlights advanced packaging systems.(2009 Taipei International Packaging Industry Show)
The Taiwan Economic News; Jul 29, 2009; ; 700+ Words ...Taipei International Packaging Industry Show (Taipei...exhibitors touted their products and services at 424...show highlighted advanced packaging systems...Topak International Co., a maker of packaging...Japan's Yamato Co. The company says...acquired the most advanced ...
Palomar Technologies Wins 2004 Advanced Packaging Award for Its Model 8000 Precision Gold Wire Bonder and Ball Bumper.
Business Wire; Jul 27, 2004; 700+ Words ...received the 2004 Advanced Packaging Award in the Specialized Advanced Packaging Equipment...sponsored by Advanced Packaging magazine...their innovative product contributions...Additionally, the products were judged...single process co-planar gold...
Semitool Ships Order For 300mm Raider Solder Bump System; Major Advanced Packaging Foundry Receives 300mm Production Tool for Solder and Lead Free Electroplating.
Business Wire; Jul 12, 2004; 700+ Words ...Precision Industries Co., Ltd (Nasdaq...of Taiwan for advanced electroplating...for wafer level packaging. The tool is...packaging program. As advanced packaging foundries...for our 300mm advanced electroplating product line." Semitool...
SEMX Corporation Signs Letter of Intent for Polese Company to Acquire Advanced Packaging Concepts, Inc.
PR Newswire; Dec 16, 1999; 700+ Words ...liabilities of Advanced Packaging Concepts, Inc...manufacturer of advanced ceramic packages...manufacturer of advanced packages and assembly...APC's multilayer co-fired ceramic...worldwide demand for advanced packaging products is enhanced by manufacturing...that, ...
TRADE NEWS: Global Advanced Packaging Technology Limited Chooses Agilent Technologies RFIC Test System to Establish First RFIC Test Line in Eastern China.
Business Wire; Apr 28, 2003; 700+ Words ...announced that Global Advanced Packaging Technology Ltd...services from the most advanced mixed-signal and...semiconductor test products is available at...atenews. About Global Advanced Packaging Technology...CCID Consulting Co., Ltd. Feb...
Flextronics and Dow Chemical announce strategic relationship to develop advanced packaging technologies; joint development of new technologies will enable each company to improve its service offering.
Business Wire; Sep 19, 1995; 700+ Words ...The Dow Chemical Co. Tuesday announced...companies will co-develop new and advanced packaging and interconnect...microelectronics and advanced packaging division...more than 2,400 product families, including...and performance products, plastics hydrocarbons...
Fujitsu Announces Capacity Expansion of Wafer Bumping and FlipChip-BGA Assembly Services; Flip-Chip Advanced Packaging is Key Feature for High-Frequency Devices.
Business Wire; Mar 13, 2001; 700+ Words ...demand for advanced packaging services for high...director of FMI's Advanced Packaging Technology...The majority of advanced future designs are...and Experience in Advanced Packaging Fujitsu...devices. These products are carefully defined and co-developed ...
Richard Otte, Former President of Raychem's Advanced Packaging Systems, Acquires Majority Interest in PROMEX Industries; Joins Company as President and CEO.
Business Wire; Jan 22, 1996; 700+ Words ...president of Raychem's Advanced Packaging Systems, has joined...capabilities in complex products cost-effectively...electronics and advanced packaging industries...Corporation's Advanced Packaging Systems...for leading-edge co-fired ceramic...
Three New Advanced Packaging Products from Shin-Etsu MicroSi, Inc. Address Demands of Flip Chip and Wafer-Level Packaging Markets.
Business Wire; Feb 27, 2007; 700+ Words ...Integrated Into Advanced Packaging Processes and Pass...the release of new products for the flip chip...markets. These products include two new...Films The first new product line, the SINR...180aeC or lower. Products in this family have...applications. Numerous advanced ...
Ultratech Receives Order from Japan's TOK for Broadband Advanced Packaging Tool; Prisma-Ghi Tool Order Validates Ultratech's Technology Expertise In the Development of Resists for Advanced Packaging Applications.
PR Newswire; Dec 2, 2003; 700+ Words ...Tokyo Ohka Kogyo Co., Ltd. for...development for advanced packaging. Ultratech...criteria for advanced packaging and...the mix of products sold, dependence on new product introductions...success of any new products, sole or limited...www.tok.co.jp/ About...
EV Group and Brewer Science's New Ultrathin-Wafer Bonding Technology Key to Advanced Packaging Applications.
PR Newswire; Dec 4, 2007; 700+ Words ...semiconductor and packaging, MEMS, silicon...high-temperature advanced packaging applications...thin and fragile product wafers -- particularly for advanced 3D and wafer-level...which EVG is also a co-founder. Stefan...handling solution for advanced packaging ...
Introducing the Quad APS-1H ... Quad Launches First Advanced Packaging System to Address Needs of Hybrid Market While Providing Full SMT Assembly Capabilities.
Business Wire; Oct 26, 1999; 700+ Words ...technology (SMT) and advanced packaging technology (APT...hybrid module advanced packaging system...control assures high product quality and reliability...technology (SMT) and advanced packaging technology...quad-europe.co.uk Fax: +1...
For Semiconductor Advanced Packaging Bump Processing, Shin-Etsu Chemical Has Introduced Ultra Thick Photoresist - SIPR-7126.
Business Wire; Feb 18, 2009; 700+ Words ...is Designed for Advanced Packaging, and GaAs and MEMS...in semiconductor advanced packaging, Shin...photoresists, the product line has solved...applications. These products, along with Shin...Etsu Chemical Co., Ltd., the...www.shinetsu.co.jp Shin-Etsu...
Global Advanced Packaging Technology -GAPT- Selects First Teradyne Tiger Test System in China.
Business Wire; Mar 12, 2003; 700+ Words ...announced that Global Advanced Packaging Technology Co. Ltd. (GAPT...in China . "As an advanced semiconductor IC packaging...worldwide services from packaging design, wafer bumping...computer-related products with high performance...
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