HighBeam QuickSearch
Get direct access to articles and research when you
add HighBeam to your browser's search toolbar.
|
-
-
BTU International Eases Transition to Lead-Free Processing with Next Generation Solder Reflow System.
-
Business Wire; Mar 2, 2004; 700+ Words
...Editors/High-Tech Writers MULTIMEDIA...s Pyramax 150 X5 solder reflow oven delivers...BTU International, Inc. (Nasdaq NM: BTUI...leading supplier of advanced thermal processing...surface mount, and advanced materials processing...leading supplier of advanced thermal processing...
-
-
ASE Group Installs Multiple 300 mm Wafer Bumping Lithography Systems from SUSS MicroTec; ASE Orders Expand Market Leadership in 300 mm Lithography Equipment for Wafer Level Solder Bumping.
-
Business Wire; Dec 2, 2003; 700+ Words
...Editors/High-Tech Writers MUNICH...announced that Advanced Semiconductor Engineering Inc (ASE, TAIEX...expand its 300 mm solder bumping capacity...to manufacture advanced semiconductor...develop systems for advanced packaging in Taiwan...
-
-
Multimedia Available: BTU International Eases Transition to Lead-Free Processing with Next Generation Solder Reflow System.
-
Business Wire; Mar 2, 2004; 536 Words
...Editors/High-Tech Writers ADVISORY...BTU International Inc. (Nasdaq:BTUI...leading supplier of advanced thermal processing...surface mount, and advanced materials processing...fifth generation of solder reflow equipment, the new Pyramax 150 X5 solder reflow oven. You...
-
-
BTU International Announces Receipt of $1.7 Million Order from Jurong Hi-Tech for Multiple Reflow Soldering Systems.
-
Business Wire; Jul 22, 2004; 700+ Words
...critical reflow solder applications at Jurong Hi-Tech facilities throughout...International, Inc. (Nasdaq NM...leading supplier of advanced thermal processing...surface mount, and advanced materials processing...from Jurong Hi-Tech. The order is...
-
-
LITERATURE.(powder coating equipment)
-
Products Finishing; Jul 1, 2000; 700+ Words
...Hubbard-Hall Inc. To obtain, enter...rectifiers and the advanced SCVC series rectifiers...cartridges feature advanced dual dimpling...Chemco Mfg. Co., Inc. To obtain, enter...nickel, fin, solder or zinc. Phibro-Tech, Inc. To obtain...
-
-
Service locator.(Products/Services)(Semiconductor industry)(Directory)(Illustration)
-
Semiconductor International; Dec 1, 2003; 700+ Words
...Aspen Technology, Inc. (617) 949-1000...Auer Precision Co., Inc. (480) 834-4637...800) 727-1605 Pac Tech Packaging Technologies...4495-0 Flip Chip, Solder Bumping MCNC (800) 727-1605 Pae Tech Packaging Technologies...Films Research, Inc. (508) 692-9530...
-
-
Service locator. (A-W).(Directory)
-
Semiconductor International; Dec 1, 2002; 700+ Words
...322-2011 Sonix, Inc. (703) 440-0222...Auer Precision Co., Inc (480) 834-4637...800) 727-1605 Pac Tech Packaging Technologies...4495-0 Flip Chip, Solder Bumping MCNC (800) 727-1605 Pac Tech Packaging Technologies...Films Research, Inc (508) 692-9530...
-
-
OSE USA Launches Flip Chip Advanced Interconnect Technologies, Substrate Design, and Assembly Services.
-
Business Wire; Jul 10, 2001; 700+ Words
...Editors/High-Tech Writers SAN JOSE...satisfaction, OSE USA, Inc., the leading onshore provider of advanced technology IC packaging...including eutectic solder, high lead solder, no lead solder...leading onshore advanced technology IC packaging...
-
-
Amkor Adds Latest Packaging Equipment to Advanced Prototype Development Lab.
-
Business Wire; Oct 17, 2000; 700+ Words
...Editors/High-Tech Writers CHANDLER...customer focus on advanced flip chip and system...In addition to advanced and traditional packaging...of the first laser solder ball attachment systems...some of the most advanced prototype packaging...Amkor Technology, Inc. is the world...
-
-
Amkor, Zuken Sign Joint Technology Partnership for the Design of Advanced IC Packaging.
-
Business Wire; Apr 12, 2000; 700+ Words
...Editors/Hi-Tech Writers WEST CHESTER...development of advanced integrated circuit...Amkor Technology, Inc., (Nasdaq...marketplace." "The advanced technology included...auto-routing of advanced IC packages...package utilizing solder balls to attach...Amkor Technology, Inc. is ...
-
-
Bruce Hueners of Palomar Technologies Elected to Editorial Board of Advanced Packaging Magazine.
-
Business Wire; Sep 18, 2003; 700+ Words
...Editors/High-Tech Writers VISTA, Calif...editorial board of Advanced Packaging magazine...been working with Advanced Packaging since its...bumping for flip chip. Advanced Packaging has been...assembly with eutectic solder, epoxy, or laser...Palomar Technologies Inc. Palomar ...
-
-
Advanced Interconnect Technologies Extends Line of Lead-Frame Packages to Include Dual-Sided Products.
-
Business Wire; Mar 3, 2003; 700+ Words
...Business Editors/High-Tech Writers PLEASANTON...Automotive Designs Advanced Interconnect Technologies...frames and lead-free solders. They are manufactured...quarter of 2003. About Advanced Interconnect Technologies Inc. Advanced Interconnect Technologies...
-
-
Palomar Technologies Wins 2003 Advanced Packaging Award for Its 6500 High Accuracy, High Speed Eutectic Bonder.
-
Business Wire; Aug 28, 2003; 700+ Words
...Editors/High-Tech Writers SEMICON West...honored with a 2003 Advanced Packaging Award at...Palomar has won an Advanced Packaging award...market today." Advanced Packaging, a PennWell...assembly with eutectic solder, epoxy, or laser...Palomar Technologies Inc. Palomar Technologies...
-
-
Semitool Receives Supplier Excellence Award from Motorola; Semitool's Advanced Copper Technology Tool Set Recognized For Excellence.
-
Business Wire; May 22, 2003; 700+ Words
...Editors/High-Tech Writers KALISPELL...2003 Semitool, Inc. (Nasdaq:SMTL...known for its advanced and innovative...introduction of advanced copper processes...front-end and advanced packaging processes...About Semitool, Inc. Semitool is...copper, gold, solder and other metals...
-
-
Fujitsu Announces Capacity Expansion of Wafer Bumping and FlipChip-BGA Assembly Services; Flip-Chip Advanced Packaging is Key Feature for High-Frequency Devices.
-
Business Wire; Mar 13, 2001; 700+ Words
...Editors/High-Tech Writers SAN JOSE...Microelectronics Inc. (FMI) will...strong demand for advanced packaging services...using lead-free solder. Fujitsu can...Microelectronics, Inc. Fujitsu Microelectronics, Inc. (FMI) designs...comprehensive portfolio of advanced ...
-
-
K&S Announces Participation as Founding Member of Global Consortium; Alliance Formation to Accelerate Commercialization of Advanced Packaging Solutions.
-
Business Wire; Dec 12, 2001; 700+ Words
...Business Editors/Hi-Tech Writers WILLOW GROVE...Soffa Industries, Inc. (Nasdaq:KLIC...the newly formed Advanced Packaging and Interconnect...providing input on solder bumping and wafer...critical to today's advanced packaging and interconnect...issues specific to advanced packaging ...
-
-
Advanced Interconnect Technologies Adds ``System-In-Package'' to Its Growing Portfolio of Packaging Devices.
-
Business Wire; Jul 22, 2002; 700+ Words
...Editors & High-Tech Writers PLEASANTON...Improved Performance Advanced Interconnect Technologies Inc. (AIT), a global...expand our line-up of advanced packaging solutions...compound (EMC) and solder. By combining multiple...
-
-
HIGH-TECH TO PROTECT NATIONAL TREASURES
-
United Press International; Mar 8, 2001; 545 Words
...03-08-2001 High-tech to protect national treasures...most technologically advanced display case will be...and sealed with lead solder. He added that the new...Titanium Industries, Inc. of Morristown, New...may also incorporate an advanced defense against laser...
-
-
Kulicke & Soffa Completes Probe Tech Acquisition, Announces Formation of Test Division.
-
Business Wire; Dec 12, 2000; 700+ Words
...amp; Soffa Industries Inc. (NASDAQ:KLIC...companies while developing advanced semiconductor interconnect...of Cerprobe and Probe Tech, K&S has made...of Cerprobe and Probe Tech with our own R&...packaging solutions include solder sphere attachment systems...
-
-
New frontiers of processing and engineering in advanced materials; proceedings.(Brief Article)(Book Review)
-
SciTech Book News; Mar 1, 2006; 537 Words
...processing and engineering in advanced materials; proceedings...Science and Engineering in Advanced... (14th: 2004...Masaaki Naka et al. Trans Tech Publications 2005 530...reaction between lead-free solder and plated iron. Distributed...20062005 Book News, Inc., Portland, OR)
|
|