Semiconductor International back issues from December 2008:
Eco-Efficient Solutions Reduce Energy, Costs.
Dec 01, 2008 ... Andreas Neuber and Parth Sethia, Applied Materials Inc., Santa Clara, Calif., www.appliedmaterials.com Besides pushing the technology, chipmakers must also drive down the use of energy and other resources in the fab -- for environmental and conservation reasons, but also for ...
Nanobama: The New Tech Regime.
Dec 01, 2008 ... Aaron Hand, Executive Editor, Electronic Media Looking like nanoscopic cookies on a tray, the 3-D likenesses of U.S. President-elect Barack Obama created at the University of Michigan were an attempt to raise awareness of nanotechnology and science. John Hart, an assistant ...
CoO Dictates Memory's Move to Copper.
Dec 01, 2008 ... Tom Caulfield, Executive Vice President, Sales, Marketing and Customer Service, Novellus Systems Inc., San Jose, www.novellus.com Ten years after its initial introduction for logic device manufacturing, copper interconnect technology is rapidly being adopted for memory chip ...
China's Chip Industry Facing Challenges.(Conference notes)
Dec 01, 2008 ... David Lammers, News Editor China's semiconductor industry is struggling to find its second wind, faced with a relative lack of strategic marketing and tough competition from larger semiconductor companies. At the SEMI International Trade Partners Conference (ITPC) last month in ...
Logic Technologies Face Off at IEDM.
Dec 01, 2008 ... David Lammers, News Editor Intel researchers will discuss the company's 32 nm platform this month in a late paper submitted to the 2008 International Electron Devices Meeting (IEDM), and describe a record-performance InSb-based pFET. IBM researchers will present a 22 nm SRAM ...
IC Industry Entering 'Capitulation Mode'.
Dec 01, 2008 ... David Lammers, News Editor The current global recession is likely to last until mid-2009, but steps that governments worldwide are taking now will result in a stronger economy beginning in the second half of next year, said Bill McClean, president of IC Insights Inc. Capital ...
Flow-Over-Wire Materials Enable Die Stacking.(Reprint)
Dec 01, 2008 ... Michael Todd, Henkel Corp., Irvine, Calif., www.henkel.com Recent advances in flow-over-wire (FOW) technologies, including FOWpastes and films, are enabling packaging engineers to design thinner packages, reduce manufacturing process steps and drive down overall package costs. ...
Single-Wafer Cleaning Tool.
Dec 01, 2008 ... Staff The Orion single-wafer cleaning system has a unique closed chamber design that permits complete control and containment of the wafer environment, addressing several cleaning-related issues for 32 and 22 nm technologies, including reduced material loss and galvanic ...
3-D Integration Technology.(Ziptronix Inc.)(Brief article)
Dec 01, 2008 ... Staff Direct Bond Interconnect (DBI) technology enables reliable, repeatable, low-cost wafer-to-wafer or chip-to-wafer bonding without the need for high-temperature compression techniques that can lower yields and raise processing costs. Such a bonding process is considered ...
CVD and ALD Tool.
Dec 01, 2008 ... Staff AltaCVD is an advanced material CVD and ALD tool that offers new capabilities to R&D facilities and pilot production lines. The combination of a proprietary reactor design and precursor introduction path with a pulsed liquid injection and vaporization enables nanoscale ...
Test & Burn-in Sockets.
Dec 01, 2008 ... Staff High-frequency center probe and CSP/[eth]-BGA test and burn-in sockets are now offered in sizes up to 6.5 mm squared with pitches down to 0.3 mm. The reduced socket pitch meets the growing need to test smaller components while ...
Jet Dispensing System.
Dec 01, 2008 ... Staff The DispenseJet DJ-100 family of piezoelectric jets combines high production speed with high accuracy and process control. The series has three models: DJ-100 Standard, DJ-100 NC for low-viscosity materials, and DJ-100 GH for highly viscous fluids. With the Jet on the Fly ...
Liquid Level Sensor.
Dec 01, 2008 ... Staff UCL-510 is a compact ultrasonic level sensor suitable for non-contact industrial water treatment, wastewater management, chemical storage, and other challenging fluid applications. The highly accurate and reliable sensor is built for ...
Double Patterning Litho Tool.
Dec 01, 2008 ... Staff The Twinscan NXT platform offers significant improvements in overlay and productivity, making it suitable for more advanced lithography, including double patterning techniques. It features a new planar wafer stage design, and a wafer stage that is ...
Fab ESH: Prepare Better, Minimize Impact.(Company overview)
Dec 01, 2008 ... Sally Cole Johnson, Contributing Editor The latest emphasis on green building and manufacturing, more efficient use of resources and preparing better for necessary changes makes for a safer, more environmentally friendly operation. In recent years, several fab ...
Laser Spike Annealing Improves Leading-Edge Devices.
Dec 01, 2008 ... Y. Wang, J. Hebb, D. Owen, and A. M. Hawryluk, Ultratech, Inc., San Jose, Calif. www.ultratech.com Millisecond and microsecond laser spike anneal improves logic and memory device performance. Shrinking thermal budgets will require a shorter anneal process, with dwell times under ...
Decoupling Platform & Tool Development for Lower CoO.
Dec 01, 2008 ... Mark Danna, Owens Design Inc., Fremont, Calif., www.owensdesign.com Collaborative development between OEMs and platform specialists can reduce internal R&D funding resources while speeding new equipment time-to-market. The semiconductor industry faces a growing ...
Optimize Wafer Thickness for 450 mm.
Dec 01, 2008 ... Tadashi Kanda, Toshiyuki Fujiwara and Kazushige Takaishi, SUMCO Corp., Tokyo, www.sumcosi.com Wafer thickness significantly affects costs and yield in wafer and device manufacturing. To avoid the problems experienced at 300 mm, the optimum thickness for 450 mm must be targeted. ...