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Article: 300 mm progress report.
- Article from:
- Semiconductor International
- Article date:
- June 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 Reed Business Information. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Two dozen fabs around the world are now experiencing the benefits of production on 300 mm wafers. The ability to fabricate more than twice as many die on a 300 vs. 200 mm wafer for a relatively small premium in equipment and facility costs has led to significant cost savings of about 30% per wafer. As the semiconductor industry begins to add capacity after an extended downturn, those companies that have made the investment in 300 mm are expected to have a key competitive edge.
Looking back, the move to 300 mm has been a long and bumpy road. It was 1993 when the industry agreed that 300 mm should be the next wafer size and that production on these large-diameter ...
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