Article: 300 mm progress report.

Two dozen fabs around the world are now experiencing the benefits of production on 300 mm wafers. The ability to fabricate more than twice as many die on a 300 vs. 200 mm wafer for a relatively small premium in equipment and facility costs has led to significant cost savings of about 30% per wafer. As the semiconductor industry begins to add capacity after an extended downturn, those companies that have made the investment in 300 mm are expected to have a key competitive edge.

Looking back, the move to 300 mm has been a long and bumpy road. It was 1993 when the industry agreed that 300 mm should be the next wafer size and that production on these large-diameter ...

Related newspaper, magazine, and journal articles:

 
 
Newsweek Harper's Magazine The Washington Post Chicago Tribune Crain's Chicago Business PRNewswire Pediatric News The Nation Advertising Age The Economist (US) A FREE trial gives you access to over 80 million articles! Access over 6,500 publications with a FREE trial!