Article: Four and five chip stacked-die CSP in a thin 1.4 mm profile. (Semiconductors).

Article: ChipPAC First to Market With Six Stacked-Die CSP; ...
PR Newswire;  November 11, 2003 ;     700+ words ... ... successfully delivered the first six stacked-die CSP in a thin, 1.6 mm profile. The 17x17mm dime-size package with >400 ... stack package is the first of its kind in stacked-die CSP, and encompasses new application and technology ...

Article: ChipPAC Offers Industry's Thinnest Four-Chip Stacked-Die ...
PR Newswire;  May 19, 2003 ;     700+ words ... ... thinnest 1.2mm four-chip stacked-die CSP products. The 10x14mm, package can house ... pushing the envelope of thin stacked-die CSP packaging, is tested to meet and exceed ... this latest package, with a lower 1.2 mm profile, enables migration of our customers System ...

Article: Entegris Launches First Internet Bare Die/CSP Tray ...
Business Wire;  July 14, 1999 ;     700+ words ... ... print catalog." Entegris' new bare die/CSP tray database enables customers to ... quantities apply. Entegris' Bare Die/CSP Tray Site is currently online. Entegris will be exhibiting bare die/CSP trays and other products used for the ...

Article: ChipPAC Scales New Heights With Four and Five Chip ...
PR Newswire;  April 21, 2003 ;     700+ words ... ... believed to be the industry's first four and five chip stacked-die CSP in a thin 1.4mm profile. The 10x14mm package, which is smaller ... ChipPAC expects it will continue to lead the market in stacked-die CSP. Functional integration is being achieved not only on the chip ...

Article: Vishay Releases New Power Metal Strip(R) Meter Shunt Resistor ...
Business Wire;  January 23, 2008 ;     700+ words ... ... HS4 and VESD09A4A-HS4 diode protection arrays, with a compact 1-mm by 1-mm footprint and an extremely low 0.4-mm profile, are designed to save board space and provide 4-line ESD data port protection in space-limited mobile electronics, such ...

Article: ChipPAC Leads Industry With 65% Market Share for 3+ Stacked-Die ...
PR Newswire;  December 16, 2003 ;     700+ words ... ... these consumer markets. Last month, ChipPAC announced the successful delivery of the first six stacked-die CSP in a thin, 1.6 mm profile. The 17x17mm dime-size package with >400 leads houses a DSP or an applications ASIC chip, along ...

Article: The MM Profile: Scott dolfi.
Money Marketing;  July 28, 2005 ;     700+ words ...GE Life's chief executive believes business is a simple affair. There are the needs of customers and you must have competitive products but service is the key. James Phillipps met him to discuss work, play and post-A-Day opportunities GE Life's kung fu master chief executive Scott Dolfi may not