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Article: 300-mm wafer systems take on leadership role: automated systems for the handling and processing of 300-mm semiconductor wafers now produce more devices than their 200-mm predecessor systems, and the trend is continuing. (Automation & Robotics).
- Article from:
- R & D
- Article date:
- June 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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During the late-1990s, the creation of 300-mm silicon semiconductor wafer processing tools was an on-again, off-again proposition as 200-mm versus 300-mm wafer handling economies were measured against the huge capital equipment investments that were required for a new set of 300-mm tools.
While considered somewhat risky at the time, semiconductor tooling equipment leader, Applied Materials, Santa Clara, Calif., committed to building 300-mm tools during the last semiconductor upturn and introduced a number of tools, including its Endura PVD (physical vapor deposition) system and Endura XP 300. Earlier this year, in the midst of the current strong economic ...