|
|
Article: New pitch for microelectronics: CIC capillary design improves UFP bonding applications.
- Article from:
- Designfax
- Article date:
- July 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 Nelson Publishing. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
The consumer market demand for smaller and more complex electronic devices is driving the wire bonding industry to set new ball bonding limits. The demand for further miniaturization in microelectronic assemblies, higher density interconnections, lower cost manufacturing processes and higher reliability performance will keep pushing the set limits into ever smaller scale. In ultra fine pitch (UFP) packaging, the following process implications should be considered:
* As the ball diameter to bond pad area ratio increases, there is a need for tighter variation control for high ball placement accuracy.
* Tighter looping control becomes critical, especially ...