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Article: Selective soldering--the future is now: optimize your through-hole soldering process down to the pin level.(On the Forefront)
- Article from:
- Circuits Assembly
- Article date:
- April 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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"Any tool can be the right tool."--Red Green
Recessions and economic slowdowns rarely have an adverse effect on the evolution of technology. In fact, such times can serve as catalysts for process efficiency improvement, as is the case with soldering through-hole components on mixed-technology printed circuit board assemblies (PCBAs).
We all know that through-hole components will persist for a majority of applications. Usually, they will be connectors or switches that, due to the application and its environment and reliability expectations, require the extra mechanical robustness of a through-hole interconnection. Also, a number of power-related ...