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Article: Are embedded passives ready for prime time? Key players and innovations shape the future of embedded components.(On the Forefront)
- Article from:
- Circuits Assembly
- Article date:
- July 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Along with the demand for cost savings and size reduction in electronics components has come the push for embedded passives in organic substrates. Embedded passives in ceramics have made this technology a lasting choice for many applications, but laminate technology has been elusive. Company representatives discussed the drivers for embedded passives at the 2003 InterNepcon Japan conference. Motorola described the addition of new features in existing form factors and efforts to shrink the area occupied by core phone functions.
Motorola's Demonstration Products
Low temperature cofired ceramic (LTCC) substrates with embedded passives have been in ...