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Article: Selective soldering: wave soldering redefined: the emergence of surface-mount technology forced engineers to rethink the wave soldering process.(On the Forefront)
- Article from:
- Circuits Assembly
- Article date:
- February 1, 2002
- Author:
CopyrightCOPYRIGHT 2002 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Surface-mount technology may continue evolving, with newer and more extensive packaging, but through-hole mounted components still appear in many applications. More and more Type I printed circuit board assemblies, comprised completely of surface-mount components, exist, but the vast majority of the industry is building applications featuring through-hole components.
The majority of the surviving classes of through-hole components are those that must endure rather rough service. Switches, connectors and some sockets may have to endure mechanical stressing that demands the robustness of a through-hole interconnection. Some applications call for components with ...