|
|
Article: Implementing a simple corrosion test method to detect "black pad" phenomenon in electroless nickel/immersion gold plating; a quick and simple method to assess the acid corrosion resistance property of as-plated EN deposits.
- Article from:
- CircuiTree
- Article date:
- November 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
Over the past several years, electroless nickel/immersion gold (ENIG) plating continues to be applied significantly in the electronics industry for its excellent planarity, solderability and wire bondability during multiple solder reflowing, wave soldering and/or aluminum wirebonding operations in the assembly process. However, inherently associated with the use of this particular surface finish of choice is the potential risk popularly known as the "black pad" phenomenon, which manifests itself as a dark gray to black trademark on the underlying nickel surface after a failed or open solder joint ensues. Through numerous studies and investigations of the "black pad" ...