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Article: Designing with ceramic thick-film embedded passives: bridging the gaps.
- Article from:
- CircuiTree
- Article date:
- December 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Embedded passives (i.e., resistors and capacitors built right into the PCB substrate) will be the next pivotal technology for the PCB industry. But PCB manufacturers and designers must first bridge the gaps between the design and part manufacturing, and between the design and available CAD tools. Here's how.
[ILLUSTRATION OMITTED]
Materials and Properties
Two ceramic thick-film materials were recently developed by DuPont Microcircuit Materials, partially under a NIST funded consortium known as the AEPT (Advanced Embedded Passive Technology). The materials and their properties have been discussed at length in the last several years (see Ref. 1, ...
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