|
|
Article: Wafer-level packaging today: WLP represents one of the most exciting and innovative frontiers in the packaging industry.(SMTA Series)
- Article from:
- Circuits Assembly
- Article date:
- February 1, 2004
- Author:
CopyrightCOPYRIGHT 2004 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
Wafer-level packaging (WLP) has enabled new advances in the miniaturization and cost reduction of portable products through its chip-size form factor and gang (wafer-level) processing. Devices such as EEPROMs, integrated passive devices (IPDs) and analog chips in WLP are now used extensively in mobile phones and other portable consumer products. In addition, WLP has been adopted for new classes of devices such as power MOSFETs to enable their use in miniaturized equipment.
A clear definition of WLP is key to understanding the trends and limitations in this packaging class. Many wafers are prepped in wafer form for assembly, either with solder bumps, gold bumps or ...
Related newspaper, magazine, and journal articles:
|
|
Article: WLP vs. 3-D Integration: Where's the Line?(wafer-level ...
Semiconductor International;
October 1, 2007 ;
700+ words
... ... distinction between wafer-level packaging (WLP) and 3-D integration? Ask a handful ... different answers. "In terms of general WLP trends, through-silicon vias (TSVs ... attention right now," said Dan Schmauch, WLP product manager at Semitool (Kalispell ...
|
|