Articles > Government magazines > Technology magazines > Semiconductor International articles > April 2004

Article: Packaging partnership offers WLP infrastructure solutions.(Semiconductor Packaging)(Wafer-level packaging)

Article from:
Semiconductor International
Article date:
April 1, 2004
Author:
Copyright

Wafer-level packaging (WLP) technology has offered huge advantages of scale since its inception. Yet, like many cutting-edge technological advancements, leveraging WLP's economy of scale remains hampered by a shortage of applications and infrastructure that justify the additional cost of implementing the technology. Still, many of today's portable wireless applications require miniaturization and performance capabilities that are paving the way to warrant WLP technology and propel industry infrastructure development.

One recent opening that supports WLP technology is the PacTech USA bumping service center in Santa Clara, Calif. The center is designed to produce ... 







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