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Article: NEMI's lead-free alloy: still applicable to today's commercially available alloys.(Cover Article)

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Circuits Assembly
Article date:
April 1, 2004
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Electronics assembly is moving to lead-free solder worldwide, but concerns still exist about processability, reliability and the choice of available alloys. The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) launched the Lead-Free Assembly Project in 1999 to address the many issues surrounding industry transition to lead-free interconnects, and the results obtained on processing and reliability of lead-free solder joints are directly applicable today.

NEMI's work focused on enhancing basic understanding of the material and assuring its reliability to assist industry with timely implementation of ...

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