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Article: Compact LTCC package modeling techniques: LTCC design poses challenges because it requires flexibility in simulation, three dimensional layout, and integration. A highly integrated EDA solution with openness to customization for LTCC components design methology, addresses this issue.(Special section: software)(Low Temperature Cofired Ceramic requirements, design and techniques)
- Article from:
- Wireless Design & Development
- Article date:
- June 1, 2004
- Author:
CopyrightCOPYRIGHT 2004 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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LTCC modules are emerging as an important solution for wireless applications based on competitive advantages in size, cost, and time-to-market (1). Despite the many advantages, LTCC development is undermined by a variety of unique technical challenges that limit the impact of EDA solutions. Traditional EDA tools have typically been "hard wired" to address either PCB design or IC design, neither of which provides all the essential features or functionality to be effective in designing LTCCs.
Although LTCCs combine some of the characteristics of both dense PCBs and ICs, effective simulation requires capabilities that go beyond the standard design methodologies for ...