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Article: Baking a pie: a review of a recent embedded passives conference shows the market smells good.(Getting Embedded)
- Article from:
- Printed Circuit Design & Manufacture
- Article date:
- August 1, 2004
- Author:
CopyrightCOPYRIGHT 2004 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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THE PRUDENT ADVICE of Dennis Fritz still resonates. During an AEPT (Advanced Embedded Passives Technology) consortium meeting in 2001, the discussion was heating up between material suppliers, fabricators and equipment vendors over who was going to capture the big share of this emerging market. Amid the arguments, Fritz imparted this perspective: "We have to bake the pie before we can divide it up." Today, in fact, although the project is completed, the group continues growing in spirit and presence. Competition between companies is kept to a professional level while we promote the emerging technology.
Which brings us to June and the IPC International Conference ...