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Article: Torch impacts heat dissipation.(Process Technology)(Brief Article)
- Article from:
- R & D
- Article date:
- September 1, 2004
CopyrightCOPYRIGHT 2004 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Thermal management is rapidly becoming the most serious challenge facing semiconductor and electronics manufacturers. Installing heat sinks and fans has been a common response to the challenge, but this solution adds expense, weight, and size to electronic devices. Heat-dissipating filler added to the protective packaging around an integrated circuit is a drop-in solution. However, the standard filler, spherical silica, is actually an insulator that does not dissipate heat.
Crystalline boron nitride has long been known as potentially the ultimate fillet, with a thermal conductivity 400 times that of silica. But it has failed to fulfill this role due to its ...