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Article: Low formaldehyde emission particleboard bonded by UF-MDI mixture adhesive.(Technical Note)
- Article from:
- Forest Products Journal
- Article date:
- September 1, 2004
- Author:
CopyrightCOPYRIGHT 2004 Forest Products Society. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Abstract
Chinese wood-based composite manufacturers are plagued with serious formaldehyde emission (F-emission) problems. Most products release formaldehyde between 35 and 60 mg per 100 g board. In this study, a particleboard with an emulsifiable diphenylmethane-4, 4'-diisocyanate (MDI)--urea-formaldehyde (UF) mixture adhesive was investigated in order to decrease F-emission to below 9 mg per 100 g board. Comparison of physical and mechanical properties of particleboard showed that the acidic agent N[H.sub.4]Cl did not improve the UF-MDI system curing, and it also affected the adhesive application method. When the two adhesives were mixed first, without adding ...