|
|
Article: Matrix Semiconductor Announces Second Generation 3-D Integrated Circuit Memory Technology.
- Article from:
- Business Wire
- Article date:
- November 8, 2004
CopyrightCOPYRIGHT 2004 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
SANTA CLARA, Calif. -- Focuses On Mobile Devices -- Targets Portable Video and Audio, Portable Games, Advanced Toys, and the Growing Installed Base of Multimedia Mobile Phones and Handheld Computers
Matrix Semiconductor, Inc. today announced that it has advanced its unique technology for manufacturing three-dimensional integrated circuits, an innovation that produces low-cost, high-density, semiconductor memory products by building multiple layers of memory inside each chip, making the most efficient use of a silicon wafer. Matrix(R) 3-D Memory (3DM) is a programmable, non-volatile memory and the first product line based on Matrix Semiconductor's technology.
...