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Article: Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications.
- Article from:
- Polymer Engineering and Science
- Article date:
- November 1, 2004
- Author:
CopyrightCOPYRIGHT 2004 Society of Plastics Engineers, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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INTRODUCTION
As the demand for smaller, lighter, thinner components and higher performance in electrical and electronic appliances continues to grow, especially in mobile devices, more effort goes into making semiconductor devices ever smaller. This increases the I/O pin count of the devices and decreases the I/O pin pitch. For those devices, PWBs (Printed Wiring Boards) with higher wiring densities are essential. To enhance the packing efficiency of PWBs, the electrical routes within a PWB are filled with a conductive adhesive to provide electrical interconnection between metal layers (1-3). A number of studies have examined the electrical properties of ...