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Article: Keeping solder joints whole: effects of bulk phosphorous content of electroless nickel layers to solder joint integrity and their use for gold and aluminum wire bonding.
- Article from:
- CircuiTree
- Article date:
- September 1, 2004
- Author:
CopyrightCOPYRIGHT 2004 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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The impact of the operating environment on the reliability of electronic devices is particularly important for certain functions, such as keypads or contact switches, where areas of the final metallic coating are exposed. Because these areas are not covered by solder and cannot be encapsulated by other protective coatings, they need to withstand corrosive environments, such as high humidity or pollutant gas. Corrosion of interconnects may cause open or short circuits.
The final coating on the PCB is one of the key issues for the reliability of the whole assembly. This deposit should act as a long-time diffusion barrier, protecting underlying copper pads at high ...