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Article: Plating high aspect ratio PCBs: achieving proper copper deposition in holes on thicker boards is no easy task, even with reverse pulse plating. Understanding the ins and outs of electrolyte agitation is critical.(Copper Plating)
- Article from:
- Printed Circuit Design & Manufacture
- Article date:
- January 1, 2005
- Author:
CopyrightCOPYRIGHT 2005 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Achieving quality electrolytic copper metallization during the production of high aspect ratio PCBs, such as back panels, isn't easy. These panels can be from 3 mm to 10 mm thick, with typical aspect ratios of 10:1, and the current trend is for thicker panels with aspect ratio up to 15:1.
One of the limiting factors in copper deposition is the mass transport of ions into high aspect ratio holes. Achieving the required copper thickness in the hole without overplating the surface (causing resist overplating with pattern plate or poor line definition with panel plate) is the biggest problem in the production of high aspect ratio panels. Also, component mounting with ...