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Article: Metal hermetic surface mount packaging. (Cover Story)
- Article from:
- Microwave Journal
- Article date:
- July 1, 1992
- Author:
CopyrightCOPYRIGHT 1992 Horizon House Publications, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Introduction
A new product line of surface mount components has been developed that employs a new package and extends the operating frequency range of surface mount components to beyond 4GHz. These packages use already existing relay type headers and flatpacks, and adapt them to true surface mount technology, with or without leads.
This new concept consists of a printed circuit board attached to the outside surface of a metal package carrying functional circuitry and enclosed by a metal cover. The complete package offers hermeticity as well as RFI/EMI shielding for designs that cannot tolerate radio frequency leakage. Pricing of the new metal packages ...