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Article: Feinfocus' WBI-Fox x-ray: dynamic void detection in wafer bumps, without gray level definition.(Equipment Advances)
- Article from:
- Circuits Assembly
- Article date:
- April 1, 2005
- Author:
CopyrightCOPYRIGHT 2005 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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The WBI-Fox x-ray inspection system, a precision x-ray inspection system designed for wafer manufacturing, addresses void detection in wafer bumps.
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Traditionally, fabricators have employed standard QA inspection tools for the detection of surface anomalies such as scratches, nodules, pits and contaminants. However, these inspection tools cannot look inside solder balls for defects such as voids. Operators pass or fail dies based on judgment, or simply reject dies containing voids. Nevertheless, voids do not necessarily imply defective bumps. Chips may be rejected unnecessarily, while "passed" bumps containing voids could ...