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Article: ChipMOS Taiwan Signs Assembly and Testing Agreements With Renesas.
- Article from:
- PR Newswire
- Article date:
- August 11, 2003
CopyrightCOPYRIGHT 2003 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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ChipMOS TECHNOLOGIES (Bermuda) LTD. ("ChipMOS Bermuda") today announced that its 70% owned subsidiary, ChipMOS TECHNOLOGIES INC. ("ChipMOS"), signed agreements in March with Mitsubishi Electric Corporation to provide wafer test service and IC assembly and test service. The agreements were consented to Renesas Technology Corporation ("Renesas").
Renesas' wafer test service order specified Mobile Memory. The wafers will be tested on ChipMOS' T5371 Advantest testing equipment and will be used on handheld electronics as end applications. On the other hand, the IC assembly and test agreement specified Low Power Memory. These ICs will be packaged by ChipMOS' TSOP ...