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Article: ChipPAC Offers Industry's Thinnest Four-Chip Stacked-Die CSP Products; Achieves 1.2mm Total Thickness CSP With Breakthrough Technology.
- Article from:
- PR Newswire
- Article date:
- May 19, 2003
CopyrightCOPYRIGHT 2003 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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ChipPAC, Inc. , one of the world's largest and most diversified providers of semiconductor assembly and test services, today announced that it is ready for volume manufacturing with the industry's thinnest 1.2mm four-chip stacked-die CSP products. The 10x14mm, package can house up to four different types of semiconductors, including ASIC and memory chips, in the smallest footprint and in the thinnest 1.2mm maximum profile thickness to accommodate the ever thinner/smaller format of such products as cell phones, PDAs and digital cameras. The thinner profile is the result of two new technologies introduced by ChipPAC into manufacturing: Wafer thinning down to less than paper ...
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