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Article: ChipPAC Scales New Heights With Four and Five Chip Stacked-Die CSP Products; Achieves 99.8% Final Yields in Volume Production of Stack CSP.
- Article from:
- PR Newswire
- Article date:
- April 21, 2003
CopyrightCOPYRIGHT 2003 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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ChipPAC, Inc. , one of the world's largest and most diversified providers of semiconductor assembly and test services, today announced that it is in high volume manufacturing of what is believed to be the industry's first four and five chip stacked-die CSP in a thin 1.4mm profile. The 10x14mm package, which is smaller than a dime, can house different types of semiconductors, including memory and ASIC chips to accommodate the feature rich applications in compact footprint products such as cell phones, PDAs, and digital cameras.
According to Electronic Trend Publications, stacked-die packages are expected to grow 35% in 2003. 80% of these packages are expected to ...