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Article: Sanmina-SCI Transparent Interconnect Process Enables ATCA Compatible Backplanes to Operate at 6.25 Gb/s.
- Article from:
- PR Newswire
- Article date:
- July 27, 2004
CopyrightCOPYRIGHT 2004 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Sanmina-SCI Continues to Lead EMS Industry With Complex Backplane and PCB Assembly
Sanmina-SCI Corporation , a leading global electronics manufacturing services (EMS) company, today introduced a Transparent Interconnect process for enhancing and evaluating the signal integrity in complex backplane and printed circuit board (PCB) assemblies. The new process features an integrated design and manufacturing methodology that enables ATCA (Advanced Telecom Computing Architecture) backplanes to operate at 6.25 Gb/s while maintaining full backward compatibility with the existing 3.125 Gb/s standard.
Sanmina-SCI's Transparent Interconnect process focuses on ...