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Article: MIDs make a comeback: 3d molded interconnect devices were supposed to be the 1980s' breakthrough for plastics in electronics--but they flopped. New processes that make market entry faster, simpler, and less costly have recharged MIDs' prospects.(MID PLASTICS)
- Article from:
- Plastics Technology
- Article date:
- June 1, 2005
- Author:
CopyrightCOPYRIGHT 2005 Gardner Publications, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Back in the 1980s, 3D molded interconnect devices (MIDs) were hailed as a breakthrough in electronics. They were expected to eliminate conventional circuit boards by putting conductive paths directly onto the surface of molded plastic devices. After failing to meet those exuberant expectations, 3D MIDs are gaining broader acceptance today as new processes, materials, and technologies converge to better meet the demands of circuit-carrying plastic parts.
Many industry observers believe MIDs have finally come of age. The market is experiencing annual growth of about 20%, according to the Research Association Molded Interconnect Devices (3D-MID) in Erlangen, ...