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Article: NxGen Electronics Increases Its Complex Packaging Assembly Capabilities with the Addition of Palomar Technologies' Latest Bonders.
- Article from:
- Business Wire
- Article date:
- July 6, 2005
CopyrightCOPYRIGHT 2005 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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CARLSBAD, Calif. -- Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announced the purchase by NxGen Electronics Inc. of Palomar's latest wire bonding and gold ball bumping equipment. NxGen Electronics Inc., San Diego, California, is an advanced microelectronics design, manufacturing, packaging, and custom assembly company. The new Palomar equipment enables NxGen to perform expanded quick-turn prototyping and complex assembly packaging processes.
Complementing its existing Palomar Model 3500-II automatic component assembly cell is the recent purchase and installation of a Palomar Model 8000 high ...