Article: Toshiba Expands Dynastron(TM) CMOS Image Sensor Line-Up With 3.2-Megapixel Chip.

Adoption of New Higher Resolution Devices in High-End Camera Phones Expected to Spur Displacement of Low-End Digital Still Cameras

SAN JOSE, Calif., Sept. 27 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the further expansion of its industry-leading Dynastron(TM) complementary metal oxide semiconductor (CMOS) image sensor product line with the addition of a new 3.2-megapixel CMOS image sensor chip. Designated ET8E99-AS, the new chip has a small 2.7-micron (um) pixel pitch with a 1/2.6-inch optical format and incorporates an analog-to- digital (A/D) converter. Combining superb picture quality with low-power consumption, it is ...

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