Article: Micro-pitch interfaces.(New Products)

Article: Size matters: next generation ASIC and FPGA packages with ...
Printed Circuit Design & Fab;  February 1, 2008 ;     700+ words ... ... current crop of BOAs with less than a 1-mm pitch are not yet pushing high pin-count and ... counts can be found in currently used 1-mm pitch packages, and this pitch will be decreasing ... Cost Since the pin-counts on 0.8-mm pitch BGAs are still reasonably low, the routing ...

Article: Hybrid socket works with 0.30-mm-pitch ...
ECN-Electronic Component News;  February 1, 2009 ;     431 words ... ... socket operates in devices with a 0.30-mm pitch or larger. The product utilizes gold ... per contact on a 0.30-mm to 0.35-mm pitch, 16 g per contact on a 0.40-mm to 0.45-mm pitch, 25 g per contact on a 0.50-mm to ...

Article: Aries Electronics Patented CSP/BallNest Hybrid Socket Provides ...
PR Newswire;  January 7, 2009 ;     700+ words ... ... can be used on any device with a 0.30 mm pitch or larger. The ZIF-style (zero insertion ... 15 g per contact on a 0.30 mm to 0.35 mm pitch, 16 g per contact on a 0.40 mm to 0.45 mm pitch, 25 g per contact on a 0.50 mm to 0 ...

Article: *REVISED* Aries Electronics Patented CSP/BallNest Hybrid Socket ...
PR Newswire;  January 8, 2009 ;     700+ words ... ... can be used on any device with a 0.30 mm pitch or larger. The ZIF-style (zero insertion ... 15 g per contact on a 0.30 mm to 0.35 mm pitch, 16 g per contact on a 0.40 mm to 0.45 mm pitch, 25 g per contact on a 0.50 mm to 0 ...

Article: Sockets suit 0.8 mm pitch SDRAM.(PACKAGING & ...
ECN-Electronic Component News;  September 1, 2008 ;     482 words ... ... introduced a BGA socket for 0.8 mm pitch SDRAM. The SG-BGA-6252 socket is designed for a 9 mm x 11 mm, 0.8 mm pitch 60-pin BGA package and SG-BGA ... designed for a 9 mm x 13 mm, 0.8 mm pitch 84-pin BGA package. The sockets ...

Article: Test Socket Industry Faces Issues Scaling Below 0.4 mm ...
Semiconductor International;  October 1, 2008 ;     700+ words ... ... Vancouver, Wash.). Shrinking from 1.0 mm pitch to 0.5 mm was easily scalable, but ... moving from 0.5 mm down to 0.3 or 0.2 mm pitch. That's one of the biggest challenges ... the holes. Although demand for a 0.2 mm pitch hasn't begun yet, 0.4 mm is becoming ...

Article: Back to back assembled 1 mm pitch BGA GHz socket ...
ECN-Electronic Component News;  December 1, 2004 ;     489 words ... ... assembled back-to-back)--SG-BGA-6130 allows 1 mm pitch 3,528 position (total pin count) BGA ICs to be used in ... accommodates IC packages such as the Xilinx FF1704 BGA, 1 mm pitch, 42 X 42 arrays. When large BGAs are mounted back to back ...