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Article: A new method for destroying organic contaminants and recycling wastewater from PCB and MF manufacturing process effluent streams.(technology update--in association with the Institute of Metal Finishing)
- Article from:
- Finishing
- Article date:
- January 1, 2005
- Author:
CopyrightCOPYRIGHT 2005 Turret West Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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INTRODUCTION
Ethylenediaminetetra-acetic acid (EDTA) and other organic chelates are widely employed in electroless plating processes used by Printed Circuit Board, Metal Finishing and Plating on Plastics manufacturers. These chelating agents can pose problems with downstream wastewater treatment, and metals and water recycling processes, due to their ability to complex heavy metal ions and their low biodegrad-abilities. Conventional treatment methods, such as carbon adsorption, air stripping and reverse osmosis can create secondary waste problems and are normally applied as 'end of pipe' treatments. The development of new technology to address these problems ...
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Article: Patent No. 7,531,708 Issued on May 12, Assigned to Scimist for ...
US Fed News Service, Including US State News;
August 4, 2009 ;
317 words
... ... Carson of Vienna, Va., and Bruce W. Bremer of Franklin, Mass., have developed a mixed waste mediated electrochemical oxidation process, the U.S. Patent & Trademark Office announced. The inventors were issued U.S. Patent ...
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