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Article: Low pressure molding: a primer: how the process compares to potting and injection molding.(Encapsulant Materials)
- Article from:
- Circuits Assembly
- Article date:
- January 1, 2006
- Author:
CopyrightCOPYRIGHT 2006 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Reduced dimensions of components coupled with higher cost and fragility are rendering traditional encapsulant and molding techniques either inadequate or unnecessarily complex. Traditionally positioned between injection molding and potting, low pressure molding presents a fast, convenient packaging solution, simultaneously encapsulating circuitry while forming the outer shell of the component to deliver a self-contained and highly integrated assembly. Low pressure molding also reduces the number of process steps required by conventional potting techniques.
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Low pressure molding refers to the process of producing molded ...