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Article: Integrated pressure monitor technology for RF MEMS.(Semiconductor Packaging)
- Article from:
- Semiconductor International
- Article date:
- February 1, 2006
- Author:
CopyrightCOPYRIGHT 2006 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Many MEMS devices, like accelerometers and mechanical resonance devices, require a vacuum for proper operation. Verifying that a package cavity has the required vacuum, though, can be a trick. Researchers in Khalil Najafi's group at the University of Michigan (Ann Arbor) have developed methods for micromachining Pirani gauges in package lids that could outperform helium leak testing for the package, according to work published in the IEEE Transactions on Advanced Packaging.
The performance of an RF MEMS device, for example, may depend on the properties of a mechanical resonating structure. The presence of air or any gas would not only hinder the motion of such a ...