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Article: Global Unichip and Tensilica Announced Partnership to Present Diamond Standard Series Hard Cores for SoC Design Technologies at 0.13um and Below.
- Article from:
- Business Wire
- Article date:
- February 21, 2006
CopyrightCOPYRIGHT 2006 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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HSINCHU, Taiwan & SANTA CLARA, Calif. -- Global Unichip Corp. (GUC) and Tensilica(R), Inc. today announced a comprehensive partnership in which GUC will create hardened versions of Tensilica's new Diamond Standard Series processors for TSMC foundry at technologies below 0.13um process. The hardened versions of the Diamond Standard Series processors, including low-cost 32-bit microcontroller and high-performance DSP cores for audio, video, and network processing, will become part of the GUC intellectual property (IP) library and available in the third quarter of 2006. With a global customer base, GUC has delivered leading edge SoC (system-on-chip) designs to customers ...