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Article: Tin/silver/copper solder increases voids.(reports on solders)(Brief article)
- Article from:
- Design News
- Article date:
- March 20, 2006
CopyrightCOPYRIGHT 2006 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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According to an extensive solder reliability study conducted by the Solder Products Value Council (SPVC), an IPC group, the tin/silver/copper (SAC) alloy family of lead-free solders is producing greater voids in the solder joint. Voids in solder joints are empty spaces within the joint that can be detected by X-ray imaging. Voids in SAC solders have been greater than 25 percent of the joint, a rejectable size for tin/lead solder joints.
The report notes, however, that the lead-free solders are reaching equivalency with the performance of tin/lead ...