|
|
Article: Probe Card Simplifies Test and Replacement.(Editorial)
- Article from:
- Semiconductor International
- Article date:
- July 1, 2006
- Author:
CopyrightCOPYRIGHT 2006 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
Alexander E. Braun, Senior Editor
Constant price pressure on memory devices drives the need for lower test costs. Many companies increase test throughput by testing more devices simultaneously. In the past, test probe cards have allowed parallel testing of additional die -- from 32 devices under test (DUTs) to 64 to 128 -- reducing the number of test platforms. Thus, being able to perform a one- instead of four-touchdown (TD) test on a 300 mm wafer can result in throughput gains.
Conservatively, it takes 10 minutes to test a flash die. This is done once before the wafer is changed, which requires an additional two minutes. It takes another three minutes ...