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Article: How to employ wafer-level packaging in MEMS IR devices.(Ion Optics Inc. with IMT Inc., microeletromechanical systems, infrared radiation )
- Article from:
- R & D
- Article date:
- July 1, 2006
CopyrightCOPYRIGHT 2006 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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A new paradigm in infrared light sources is available today as a result of the collaboration between Innovative Micro Technology (IMT) and Ion Optics, Inc (IOI). The device combines the benefits of photonic crystal technology with low cost, high volume silicon micromachining. The technology utilizes state of the art wafer-level vacuum packaging (WLP) from IMT, enabling low power battery-operated infrared emitters built directly on a silicon chip. The new Ion Optics' photonic crystal enhanced (PCE) MEMS micro-hotplate device promises a number of significant applications in both military combat identification and commercial and biomedical gas sensing technology.
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