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Article: Toshiba Expands Dynastron(R) CMOS Image Sensor Line-Up With 3.2 Megapixel and 2.0 Megapixel Chips; 2.0 Megapixel SoC Incorporates ISP for Advanced Camera Operations and Special Picture Effects.
- Article from:
- PR Newswire
- Article date:
- September 27, 2006
CopyrightCOPYRIGHT 2006 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Company Reinforces CMOS Imaging Leadership With New Devices Combining Small Pixel Size and Superb Picture Quality; Targeted at Expected 2007 Market Sweet Spot for Camera Phones
SAN JOSE, Calif., Sept. 27 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the further expansion of its industry-leading Dynastron(R) complementary metal oxide semiconductor (CMOS) image-sensor product line with the addition of two new chips, the 3.2 megapixel ET8EE6-AS CMOS image sensor and 2.0 megapixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP). With a pixel pitch of just 2.2 microns, a significant advance in ...