Article: Toshiba Expands Dynastron(R) CMOS Image Sensor Line-Up With 3.2 Megapixel and 2.0 Megapixel Chips; 2.0 Megapixel SoC Incorporates ISP for Advanced Camera Operations and Special Picture Effects.

Company Reinforces CMOS Imaging Leadership With New Devices Combining Small Pixel Size and Superb Picture Quality; Targeted at Expected 2007 Market Sweet Spot for Camera Phones

SAN JOSE, Calif., Sept. 27 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the further expansion of its industry-leading Dynastron(R) complementary metal oxide semiconductor (CMOS) image-sensor product line with the addition of two new chips, the 3.2 megapixel ET8EE6-AS CMOS image sensor and 2.0 megapixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP). With a pixel pitch of just 2.2 microns, a significant advance in ...

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