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Article: PTH solder joint inspection: automated x-ray laminography ensures through-hole joints meet barrel fill specs.(Test and Inspection)
- Article from:
- Circuits Assembly
- Article date:
- November 1, 2006
- Author:
CopyrightCOPYRIGHT 2006 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Although plated through-hole package production is a mature process, it still results in unreliable and poor quality solder joints. IPC-A-610 specifies that an acceptable criterion for through-hole solder joints is that at least 75% of the barrel is filled along the board thickness and that a bottom fillet is present. Various testing technologies exist to ensure a sound electrical connection is created, but automated x-ray laminography is the only available technology that can ensure the through-hole solder joint meets the IPC-A-610 specifications of barrel fill.
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The widely used technique of wave soldering the bottom side ...