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Article: Microfluidic Technology set to chill your chips.
- Article from:
- Sensors Magazine
- Article date:
- August 1, 2005
- Author:
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Copyright informationCOPYRIGHT 2005 Questex Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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When ICs get too hot they can fail due to electromigration or as a result of the expansion rate differential between the silicon and the organic package substrates. As the power density of high-performance ICs increases, such as 3D multichip modules that cram more processing power into less real estate, conventional heat sinks will not solve the problem. Georgia Tech research assistant Bing Dang and colleagues Paul Joseph, Muhannad Bakir, Todd Spencer, Paul Koh, and James Meindl have devised a better way to chill the chips microfluidic channels.
"The challenge of 3D integration now," says Dang, "is that if you have several chips stacked on one another, there is no way to ...
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