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Article: Improvements in Pb-free stencils: nickel has inherent benefits as a stencil medium, and refinements make it a superior choice to steel.(Nickel Stencils)
- Article from:
- Circuits Assembly
- Article date:
- December 1, 2006
- Author:
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Copyright informationCOPYRIGHT 2006 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Nickel is proving to be a valuable element aiding the move to cost-effective Pb-free assembly at high production volumes. When screen printing with Pb-free (SAC) solder pastes, stencils made from pure nickel or a nickel alloy help to achieve paste transfer efficiency comparable to the levels achieved using SnPb pastes with stainless steel laser-cut stencils. Combined with the efficiencies of the frame-mounted interchangeable foil stencil system, nickel is the optimal stencil medium for maximum Pb-free process repeatability and productivity.
Laboratory tests have highlighted a reduction in paste transfer efficiency because of the higher coefficient of friction between SAC ...
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