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Article: Programs scheduled for IADD/FSEA 2007 Odyssey.(IN MILWAUKEE)
- Article from:
- Official Board Markets
- Article date:
- January 20, 2007
CopyrightCOPYRIGHT 2007 Questex Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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The International Association of Diecutring and Diemaking (IADD)/Foil Stamping and Embossing Association (FSEA) 2007 Odyssey will offer three days of educational sessions, both in the classroom and on the Techshop[TM] floor. The programs are designed to educate, solve challenges, and foster open discussions in a variety of converting areas. The Odyssey will be held May 2-4 at the Midwest Airlines Center in Milwaukee, Wis.
Attendees will discover technologies and real-time solutions to increase profitability and productivity in the areas of diecutting, diemaking, foil stamping, embossing, folding carton, corrugated, and specialty markets. In addition to the ...