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Article: A novel low melting point Pb-free solder: a SnBiX solder showed a melting point of about 186[degrees]C and cut the material cost.
- Article from:
- Circuits Assembly
- Article date:
- February 1, 2007
- Author:
CopyrightCOPYRIGHT 2007 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Many organizations, such as iNEMI, the National Center for Manufacturing Sciences, Improved Design life and Environmentally Aware manufacture by Lead-free Soldering (IDEALS) and the Japan Electronic Industry Development Association (JEIDA) have recommended certain Pb-free alloys (1-4). The most common recommendations are SnAg (including SnAgCu, or SAC), SnCu, SnZn and SnBi solders. SnAg solders, e.g., SnAgAg, SnAg3.0Cu0.5 (as recommended by JEIDA and NCMS), SnAg3.8AgCu0.7 (recommended by IDEALS) and SnAg3.9AgCu0.6 (recommended by iNEMI) have good mechanical and thermal properties, but their wettability to copper surfaces is poor and their cost is high. Furthermore, their ...