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Article: High-speed wire bonder.(Product PREVIEW)
- Article from:
- Circuits Assembly
- Article date:
- February 1, 2007
CopyrightCOPYRIGHT 2007 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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BondJet BJ915 heavy wire bonder reportedly offers high speed and accuracy, and a work area of 15 x 19.6". Highlights are said to include bonding speeds reported as fast as 450 ms/wire (300 [micro]m diameter 8 mm loop length wire) and 10 [micro]m at 3[sigma] placement accuracy. Said to be the only heavy wire bonder with both integrated pull test and nondestructive shear test ...
Related newspaper, magazine, and journal articles:
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Article: German Inventor Develops Wire Bonder
US Fed News Service, Including US State News;
December 6, 2008 ;
433 words
... ... has developed a method of operating wire bonder. According to the abstract released ... Patent & Trademark Office: "Wire bonder having a bonding head which has a bonding ... projects beyond a bonding contact, the wire bonder having a camera with a downstream image ...
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