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Article: Humidity and pollution effects on Pb-free assemblies: a study of how metallization and operating voltage influence electrochemical migration.(Cover Story)
- Article from:
- Circuits Assembly
- Article date:
- April 1, 2007
- Author:
CopyrightCOPYRIGHT 2007 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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A leading automotive industry survey expects an electronics part growth of 30% to 40% by 2008. The most common failure mechanisms are described in this recent scientific synopsis, namely electrochemical migration and leakage currents induced by corrosion. (1) As briefly described in a recent contribution to Kester's Lead-Free Connection newsletter, the presence of silver in common Pb-free alloys has been identified as critical to the assemblies' long-term reliability. The two major sources of climatic-induced failures are described here in detail to better understand their cause and minimize potential failures.
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