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Article: Phase separation behavior. (Rubber Modified Epoxy Resin, part 2)
- Article from:
- Polymer Engineering and Science
- Article date:
- November 15, 1994
- Author:
CopyrightCOPYRIGHT 1994 Society of Plastics Engineers, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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INTRODUCTION
Due to the excellent mechanical, electrical, and thermal properties of epoxy resin, it is widely used in aerospace, electronic, and general purpose molding applications. The application, however, is somewhat limited due to its poor crack resistance and impact resistance. In order to improve the toughness of the epoxy resin, low molecular weight liquid rubbers, such as ATBN(amine-terminated butadiene acrylonitrile random copolymer), CTBN(carboxyl-terminated butadiene acrylonitrile random copolymer), and HTBN(hydroxyl-terminated butadiene acrylonitrile random copolymer), are incorporated in the resin formulation.
The impact strength of the ...