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Article: IDE Launches AWP 300-2 Silicon Wafer Packer With State-of-the-Art Upgrades.
- Article from:
- Business Wire
- Article date:
- March 7, 2007
CopyrightCOPYRIGHT 2007 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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RANDOLPH, Mass. -- The highly evolved, high-speed, second generation AWP 300-2 Silicon Wafer Packer from Integrated Dynamics Engineering (IDE) was unveiled here in IDE's U.S. headquarters during the company's recent international sales meeting. Among its many new features, the AWP 300-2's unique dual robot design achieves proven, reliable throughput of 150 wafers per hour, along with unprecedented safe handling.
IDE's AWP 300 Series was first introduced in 2005. Now this fully upgraded 300 mm wafer packer features IDE's new patented end-effector technology for the safest handling ever of all silicon wafers (including those that are extremely warped) and the ...